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Metallurgical Microscope LMM-C11 Catalog

Metallurgical Microscope LMM-C11

Metallurgical Microscope LMM-C11

Overview

Metallurgical Microscope LMM-C11 is specifically designed for research purpose. Features superior quality plan achromatic objective with long working distance, triple layer mechanical stage, Trinocular head, filters namely blue, yellow and green, quintuple nosepiece etc. which makes it highly efficient and reliable. It has wide applications in research work in metallography, mineralogy, electronics etc.

Features

  • - Adopts plan achromatic objective with long working distance
    Wide-field eyepieces
    Quintuple nosepiece
    Large move range triple layered mechanical stage
    Green, blue, yellow filter
    Reflected vertical illumination
Specifications
Optical SystemUIS optical system
Viewing HeadTrinocular, Inclination of 30˚, (Analyzer with field diaphragm to switch)
EyepieceWide field WF 10X /18 mm
ObjectiveInfinite Plan Achromatic Objectives with long working distance (no cover glass) PL 5X/0.12, PL L 10X/0.25, PL L 20X/0.40, PL L 40X/0.60, PL L 80X/0.80
NosepieceQuintuple (Frontward ball bearing inner locating)
StageThree layer mechanical Size:250 mm × 230 mm, movingrange:154 mm × 154 mm
Focus systemStage adjustable, Coaxial coarse/fine focus system, with tensional adjustable and up stop, minimum division of fine focusing: 0.7 µm
Vertical illumination unit6V 20 W halogen lamp, brightness control Vertical illumination with field diaphragm, aperture diaphragm and polarizer, (Y,B,G) filter and frosted filter
Dimension590 × 500 × 430 mm
Weight21 kg
Optional Accessories :

Accessories no.Name
1Dividing  10X (µ18mm)   0.1mm/Div
2Plan achromatic objectives with long working distance (no cover glass) PL L 50X/0.70
3Plan achromatic objectives with long working distance (no cover glass) PL L 100X/0.85 (Spring)
4CCD adapter 0.5X
5CCD adapter 1X
6CCD adapter 0.5X  with dividing 0.1mm/ Div
75MP HD1 1080P HDMI Microscope Camera
8TRetina6 6MP camera, USB3.0

Applications :

Metallurgical Microscope is used to inspect semiconductor chips, integrated circuits, structures of metals and alloys etc.

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